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| Query process ID | GO:0006289 |
| Process name | A DNA repair process in which a small region of the strand surrounding the damage is removed from the DNA helix as an oligonucleotide. The small gap left in the DNA helix is filled in by the sequential action of DNA polymerase and DNA ligase. Nucleotide excision repair recognizes a wide range of substrates, including damage caused by UV irradiation (pyrimidine dimers and 6-4 photoproducts) and chemicals (intrastrand cross-links and bulky adducts). |
| Organism | Oryza sativa |
| ECC | Gene ID | Repr. ID | Gene name | Functional description | Ev | AGI code | Arabidopsis gene name | O.I. | H.G. | Other DB |
|---|---|---|---|---|---|---|---|---|---|---|
| L | Os01g0592900 | AK102072.1 | - | The start codon is not identified. | 5e-4 | At1g79950 | helicase-related | O.I. | H.G. | |
| L | Os02g0179300 | AK069065.1 | - | RAD23 protein, isoform II | 9e-10 | At1g16190 | DNA repair protein RAD23, putative | O.I. | H.G. | |
| L | Os04g0397100 | - | - | - | 0 | - | - | O.I. | H.G. | |
| L | Os04g0397500 | AU174699 | - | Myb, DNA-binding domain containing protein | 2e-1 | At2g25670 | unknown protein | O.I. | H.G. | |
| L | Os05g0144800 | AK099724.1 | - | TFIIH basal transcription factor complex helicasesubunit (EC 3.6.1.-) (DNA-repair protein complementingXP-D cells) (Xeroderma pigmentosum group D complementingprotein) (CXPD) (DNA excision repair protein ERCC-2) | 3e-38 | At1g03190 | UVH6 (ULTRAVIOLET HYPERSENSITIVE 6) | O.I. | H.G. | |
| L | Os05g0219800 | AK102822.1 | - | DEAH helicase isoform 6 | 1e-4 | At1g79890 | helicase-related | O.I. | H.G. | |
| L | Os06g0264300 | AK061556.1 | - | UV excision repair protein Rad23 family protein | 1e-12 | At3g02540 | RAD23-3 (PUTATIVE DNA REPAIR PROTEIN RAD23-3) | O.I. | H.G. | |
| L | Os08g0172200 | AK101266.1 | - | UvrB/UvrC protein domain containing protein | 2e-1 | At2g11910 | unknown protein | O.I. | H.G. | |
| L | Os08g0427500 | AK102608.1 | - | DNA repair protein Rad4 family protein | 2e-6 | At5g16630 | RAD4 | O.I. | H.G. | |
| L | Os08g0430200 | AK063768.1 | - | OsRAD23 | 6e-20 | At5g38470 | DNA repair protein RAD23, putative | O.I. | H.G. | |
| L | Os08g0516000 | - | - | - | 0 | - | - | O.I. | H.G. |
| Process ID | Gene number | Process name |
|---|---|---|
| GO:0006281 | 38 | The process of restoring DNA after damage. Genomes are subject to damage by chemical and physical agents in the environment (e.g. UV and ionizing radiations, chemical mutagens, fungal and bacterial toxins, etc.) and by free radicals or alkylating agents endogenously generated in metabolism. DNA is also damaged because of errors during its replication. A variety of different DNA repair pathways have been reported that include direct reversal, base excision repair, nucleotide excision repair, photoreactivation, bypass, double-strand break repair pathway, and mismatch repair pathway. |
| Process ID | Gene number | Process name |
|---|---|---|
| GO:0000715 | 0 | The identification of lesions in DNA, such as pyrimidine-dimers, intrastrand cross-links, and bulky adducts. The wide range of substrate specificity suggests the repair complex recognizes distortions in the DNA helix. |
| GO:0000717 | 0 | The unwinding, or local denaturation, of the DNA duplex to create a bubble around the site of the DNA damage. |
| GO:0000718 | 0 | The removal of the oligonucleotide that contains the DNA damage. The oligonucleotide is formed by dual incisions that flank the site of DNA damage. |
| GO:0000720 | 0 | The repair of UV-induced T-T, C-T, and C-C dimers by the recognition and removal of the damaged DNA strand from the DNA helix as an oligonucleotide. The small gap left in the DNA helix is filled in by the sequential action of DNA polymerase and DNA ligase. |
| GO:0006283 | 0 | The nucleotide-excision repair process that carries out preferential repair of DNA lesions on the actively transcribed strand of the DNA duplex. In addition, the transcription-coupled nucleotide-excision repair pathway is required for the recognition and repair of a small subset of lesions that are not recognized by the global genome nucleotide excision repair pathway. |
| GO:0006293 | 0 | The stabilization of the multiprotein complex involved in damage recognition, DNA helix unwinding, and endonucleolytic cleavage at the site of DNA damage as well as the unwound DNA. The stabilization of the protein-DNA complex ensures proper positioning of the preincision complex before the phosphodiester backbone of the damaged strand is cleaved 3' and 5' of the site of DNA damage. |
| GO:0006294 | 0 | The aggregation, arrangement and bonding together of proteins on DNA to form the multiprotein complex involved in damage recognition, DNA helix unwinding, and endonucleolytic cleavage at the site of DNA damage. This assembly occurs before the phosphodiester backbone of the damaged strand is cleaved 3' and 5' of the site of DNA damage. |
| GO:0006297 | 0 | Repair of the gap in the DNA helix by DNA polymerase and DNA ligase after the portion of the strand containing the lesion has been removed by pyrimidine-dimer repair enzymes. |
| GO:0033683 | 0 | A process that results in the endonucleolytic cleavage of the damaged strand of DNA. The incision occurs at the junction of single-stranded DNA and double-stranded DNA that is formed when the DNA duplex is unwound. |
| GO:0070911 | 0 | The nucleotide-excision repair process by which DNA lesions are removed from nontranscribed strands and from transcriptionally silent regions over the entire genome. |
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